河套 IT TALK——TALK 38:(原创)全图说晶圆技术的发展历史
在前面的河套IT Talk 系列中,我们出过二十期的全图说,分别谈到了超文本和超链接,编程语言、机器人、电动汽车、无线通信、卫星、计算机硬件、操作系统、开源软件、电子游戏和、图像处理、IETF、动画技术、Wi-Fi、音频编解码、电视、物联网通信技术和脑机接口发展历史,以及ACM的特别兴趣工作组(SIGs)。反响不错,这个系列我们后续还会继续做下去,今天给大家展开的话题是晶圆技术的发展历史。
硅,这种广泛分布于土壤、沙粒中的元素,在20世纪中旬,以一种惊艳的姿态走进人们的视野,这个元素也成就了硅谷。半导体和集成电路产业,也在过去几十年间,以惊人的速度突飞猛进,改变着我们的世界,也促成了信息科技大爆炸。今天,我们来谈一下半导体集成电路制造工艺中,经常提到的晶圆( Wafer )制造的发展历史。小小的晶圆,汇集了物理、化学的顶级专家技术的结晶。随着工艺的变革,也一次又一次地突破人类本以为是极限的障碍。从中,我们也能一窥国家战略博弈的五味杂陈。其中可讲的故事很多,本文不能一一道来。我尝试抽丝剥茧,从纷繁复杂的技术中,选择关键的事件和人物,按照年代顺序进行线性展开,做一个归纳性介绍。希望对大家有所帮助和启迪。
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以上所有的图片都增加了知识共享许可协议(CC):要求转载时署名(BY),非商业性使用(NC),并且以相同方式共享(SA)。
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为了让大家能够更方便地运用上述信息,我还梳理了pdf版本,扫描下面二维码或者点击链接获取“全图说晶片的发展历史 V1.0.pdf”文件:
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