GCC Sub-forum on Chiplet Innovation and Development
Date: March 29, 2025
Location: Beijing
Organizers: Global Computing Consortium (GCC), Zhongguancun High-Performance Chip Interconnection Technology Alliance (HiPi)
Agenda:
Keynote Speech: By Miao Fuyou, Chief Technology Officer of GCC, titled "Driving Technological Architecture Innovation, Accelerating Computing Industry Development."
Technical Presentations: Topics include Chiplet evolution from a computing perspective, silicon photonics, and advanced packaging technology.
Roundtable Discussion: Building Chiplet Competitiveness: Collaborative Innovation Needs and Challenges.
Registration: Register via the official GCC website or the official channels of the HiPi Alliance.